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5G Infrastructure

5G network infrastructure provides three main use cases to realize the connectivity required for artificial intelligence, cloud computing, big data, edge computing and other advanced technologies. These technologies are designed to empower smart city, smart manufacturing (Industry 4.0) and autonomous driving.

They include:

  • eMBB (enhanced Mobile BroadBand)
  • mMTC (massive Machine Type Communication)
  • URLLC (Ultra Reliable Low Latency Connection)

Our engineered materials portfolio and solutions are widely used in large and small base stations, various network servers and other communication infrastructures, exceeding performance expectations.


Base Station Antenna

5G, the next generation of technology for communication networks, has been deployed since 2019 and will continue for many years to come. Base station antennas with 5G bandwidth (sub 6GHz and mmWave) are a critical enabler for 5G connectivity. Innovative solutions from Celanese will help customers realize true connectivity.

Main applications:

Antenna

Applications Requirements:

  • Stable dielectric properties (Dk and Df) under challenging environments
  • Low warpage after SMT
  • Dimensional stability
  • SMT: 265°C reflow, blister free
  • Platability
  • UL94 V-0, Halogen free

Recommended materials:

  • Zenite® & Vectra® LCP offers tailored Dk, 3.0~22.0@2GHz and low Df 0.0009~0.003@2GHz
  • Fortron® PPS with low moisture uptake (<0.1%), minimizes Dk/Df shift under harsh conditions and offers good platability while withstanding SMT 265° C

Radome

Our injection molded products provide high yield rate and overall strength in secondary processing, and they can be processed at high temperatures.

Applications Requirements:

  • Weatherability: UL 746C f1 rating
  • Mechanical retention >50% at 85 °C temperature/85% low humidity for 2,000 hours
  • Low dielectric properties: Dk 3 or lower and Df 0.002 or lower
  • Halogen-free UL94 V-0
  • Lower density
  • Dimensional stability

Recommended materials:

  • Celanese offers tailor-made, light-weight Celstran® LFT with good impact strength, weather-resistance, low Dk/Df and robust UL94 V-0 flammability

Enclosure

Applications Requirements:

  • UL94 V-0 rating 2.0 mm
  • High stiffness and good flatness - ±1mm for total length of cover
  • Platability with existing processing
  • EMI shielding efficiency: 80-120 dB (frequency range 400MHz-4GHz)

Recommended materials:

  • Fortron® PPS ensures proper EMI shielding performance under fastening with an EMI gasket along its outer edge and any inner cavities. Its low warpage will release the space or gap between enclosure and gasket
  • Celstran® LFT with stainless steel fiber can provide EMI shielding capability >80dB

Server

5G networks enable next level usage of big data, requiring more servers for communication, data storage and edge computing. Not only will this increase the number of servers but will also create demand for better performing solutions. Celanese collaborates with component manufacturers to develop new products for next generation connectivity.

Main applications:

Highspeed Connector

Applications Requirements:

  • To ensure signal integrity and high transmission speed, the same impedance value is necessary for the entire system, including the connector
  • More pins are required to increase transmission speed in the connector
  • Power consumption of the overall system should be low, and heat generation should be less
  • Excellent flowability to enable design freedom and miniaturization
  • Low warpage and dimensional stability after SMT

Recommended materials:

  • Celanese offers tailored Dk (3.0~22.0@2GHz) and low Df LCP products, while keeping high flow and post-reflow blister-free properties

CPU Socket

Applications Requirements:

  • Excellent filling for thin wall structure
  • Low warpage after molding and soldering
  • High mechanical strength to avoid cracking
  • Heat resistant for reflow soldering and blister free
  • Halogen-free UL94 V-0

Recommended materials:

  • Celanese offers high flow and low warpage Zenite® & Vectra® LCP with improved thin-wall filling, flatness and blister-free properties for the manufacturing process. Vectra® and Zenite® LCP products enable design freedom for high-pin count CPU sockets.

Other Communication Infrastructure

Since 5G networks use a higher frequency, there is increasing concern about moisture absorption and its impact on component dielectric performance. To achieve high frequency and high transmission speeds, the requirement of film substrate dielectric performance is more stringent. Celanese LCP provides new solutions for film substrates to realize seamless connectivity.

Main applications:

Film and Substrate

Applications Requirements:

  • Low dielectric properties (Dk and Df) and stability across wide frequency under harsh conditions
  • Low moisture uptake
  • Heat resistance
  • Low CLTE
  • Good mechanical strength
  • Good film processability

Recommended materials:

  • Celanese offers low Dk/Df Zenite® and Vectra® LCP (Dk 3.0~4.0@2GHz, Df 0.0006~0.003@2GHz) with minimized Dk/Df variance across frequency

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