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Material solutions for 5G Connectivity

Looking for tunable Dk/Df liquid crystal polymer (LCP) solutions or other high-performance engineering thermoplastics with EMI shielding and thermally conductive functionalities for reliable connectivity?


Zenite®/Vectra® LCP

Zenite®/Vectra® LCP is a family of halogen-free, high-performance polymers that provide high-temperature performance in eco-friendly thin-wall applications with exceptionally precise and stable dimensions. To meet complex 5G connectivity requirements, we’ve expanded our Vectra® and Zenite® LCP to offer:

Key Applications:

  • Antenna
  • High Speed Connector
  • CPU Socket
  • Film and Substrate
  • Connectors
  • Compact Camera Modules
  • Chargers

To learn our how our new LCP grades can support your product innovations, download our sell sheets.

Fortron® PPS

Fortron® polyphenylene sulfide (PPS) is a high-temperature semi crystalline polymer that provides high thermal stability, very high chemical resistance, inherent flame retardance, stiffness, strength, creep resistance and good flowability, offering freedom to accommodate design complexity and consolidation of parts. To meet 5G connectivity requirements, we’ve expanded our Fortron® PPS to offer:

Key Applications:

  • Base Station Antenna Enclosure
  • NMT Frame

Celstran® LFRT

Celstran® long fiber reinforced thermoplastics (LFRT) unite long fiber reinforcements with advanced thermoplastic resins for a combination of mechanical properties, impact, creep resistance and low warpage. To meet complex 5G connectivity requirements, we’ve expanded our Celstran® to offer:

Key Applications:

  • Base Station Antenna

Celanex® PBT

Celanex® thermoplastic polyester (PBT) is a semi crystalline structure based on polybutylene terephthalate that provides high strength, rigidity and toughness, low creep even at high temperatures and resistance to a wide range of chemicals, solvents, oils and greases. To meet challenging requirements of mobile devices, we’ve expanded our Celanex® PBT to offer:

Key Applications:

  • NMT Frame

Coolpoly® TCP

Coolpoly® thermally conductive plastics (TCP) are part of our engineered materials portfolio. They are formulated compounds using commodity engineering and high-performance grade thermoplastic resins. Various additives and ingredients are compounded to impart thermal conductivity among other desirable attributes. To meet complex 5G connectivity requirements, we’ve expanded our Coolpoly® TCP to offer:

Key Applications:

  • Base Station Antenna

Frianyl® PPA

Frianyl® XT flame retardant PPA compound was developed for electrical and electronic applications with thermal requirements significantly higher than those of PA66. It offers high stiffness and strength at elevated temperatures, high dimensional stability, excellent creep resistance, and resistance to chemicals and hydrolysis. To meet complex requirements of mobile devices, we’ve expanded our Frianyl® PPA to offer flame-retardant grades for all colors.

Key Applications:

  • Speakers in Mobile Devices

Solutions

Our broad polymer portfolio not only offers various solutions to support 5G performance but also provides technical capabilities to meet your requirements, including:

Electro Magnetic Testing Capability

  • Dielectric Dk/Df measurement
  • EMI shielding effectiveness measurement

CCM Testing Capability

  • Dimensional stability, thread-line integrity inspection, surface morphology test
  • Particle amount in tumbling test
  • Heat cycle, moisture absorption test
  • Mechanical strength, weld line/impact test
  • Surface integrity inspection in ultrasonic cleaning, particle test

CAE Capability

  • Flatness improvement with part design and tooling optimization
  • Part assembly strength evaluation and improvement with design suggestions

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